Epoxy resin (Epoxy) LED production process used, is one of the key LED industry making the product. Epoxy resins are generally refers to molecules containing two or more epoxy groups of organic polymers, except for a few, but they are not high relative molecular quality. Molecular structure of the molecular chain of the epoxy resin is an epoxy group-containing reactive its characteristics, the epoxy groups may be located at ends of the molecular chain or in the middle of a cyclic structure. Because of the molecular structure of the epoxy group-containing reactive, so that they can react with the crosslinking curing agent various types formation of insoluble, infusible polymer having a three-to a mesh structure. 

 

LED IC itself, etc. In order to maintain air tightness and protect the die from external attack, etc., to prevent moisture intrusion from the outside and so as to mechanically support the conductors and effectively discharging heat generated inside and to prevent the electronic component is subjected to mechanical vibration, and breakage caused by the impact of changes in device characteristics. Different shapes and material properties (doped or undoped bulk of the toner), from the lens or a diffusing lens function, can provide a hand-held form. 

 

One, LED curing sealant resin with temperature and time 

 

1 General LED sealed plastic resin with an acid anhydride hardener, hardening temperature of about 120 ~ 130 ℃. 

2. promoting additive for its curing time is shortened. 

 

Second, the hardening time and crooked phenomenon and hardening rate 

1 small thermal conductivity resin, which affects the internal hardening heat accumulation hardening rate. (Response rate) Epoxy resin Manufacture

2 inside (hardening heat) outside (oven) heat Disply case easily deformed. 

 

Third, with the ratio of resin and hardener and characteristics 

Depending on the desired characteristics of the use of 1 hardener terms. 

2 General hardener mix ratio is low, the hardness of the cured product is hard and yellowing. 

3 hardener mix ratio for a long time, cured brittle and less colored.

 

Four, Tg (glass transition point) and the HDT (heat distortion temperature) 

Test Method 1: TMA, DSC.b: the temperature difference between the two is 2 ~ 3 ℃. 

2. added fillers Tg high. 

Electrical Characteristics 3 epoxy (Insulation resistance Dielectric loss rate and loss rate) is low and the heat distortion temperature of consistency as much. 

The epoxy resin used for constituting the shell must have a moisture resistance, insulation resistance, mechanical strength, the refractive index of the LED emits light and a high transmittance. ion of packaging materials having different refractive indices, the impact of the geometry of the photon escape encapsulation efficiency is different, but also the luminous intensity distribution angle of the die, a light output, and the materials and packaging of the lens shape. The use of the resin lens-tip, the light can concentrate the axial direction of the LED, the corresponding angle is small; if the top of the resin lens is a circular or flat type, the viewing angle will be increased accordingly.